

Cooling AI Factory: From System to Data Center Architecture
Wednesday, June 24, 2026 4:40 PM to 5:00 PM · 20 min. (Europe/Berlin)
Hall H, Booth L01 - Ground Floor
HPC Solutions Forum
Data Center Infrastructure and Cooling
Information
As AI infrastructure evolves toward rack-scale systems with unprecedented power density, cooling has become a critical architectural challenge rather than a supporting function. Traditional air-cooling approaches are reaching their practical limits as next-generation AI platforms demand higher thermal efficiency and system-level integration.
The presentation argues that cooling is no longer a supporting subsystem, but a foundational architectural element that directly determines AI infrastructure scalability, efficiency, and operational resilience.
The presentation argues that cooling is no longer a supporting subsystem, but a foundational architectural element that directly determines AI infrastructure scalability, efficiency, and operational resilience.
HPC Solutions Forum Questions
What is the best way to keep advancing HPC in an AI-driven world?
Format
on-site
Registered attendees
CM
Christian Muth
Computational ScientistJohannes Gutenberg-Universität Mainz
