Asterfusion

Asterfusion

Exhibitor

Information

Asterfusion: Redefining HPC & AI Networking

Asterfusion delivers a portfolio of high-performance open switches (1G-1.6T) for AI & HPC. Based on a decade of SONiC expertise, our solutions feature ultra-low latency (450ns) and massive 102.4T switching capacity to break vendor lock-in.

ISC 2026 Highlights
Visit Booth A41 for: · 1.6T Live Demos: Pioneering high-density AI networking. · 450ns Low Latency: Speed optimized for massive AI training. · Exclusive Giveaways: Scan to get our trendy laser bags and pony charms! Empower your network with Asterfusion.

Company/Institution Details

Products and Services
Cloud ServicesData Center Infrastructure SolutionsMachine Learning/AINetworks/InterconnectsSystem Software Development and Support
Country
China
URL
https://cloudswit.ch/

Further resources and information

Description
AsterNOS-Enterprise-ready SONiC Distribution
URL
https://cloudswit.ch/product/sonic-enterprise-distribution/
Description
AIDC & HPC Switches Catalog
URL
https://cloudswit.ch/product-category/sonic-nos-based-data-center-switches/

Social media

Contact details

https://cloudswit.ch/
China

Sessions

First-time Exhibitor Pitch

Tuesday, June 23, 2026 12:45 PM to 1:15 PM
Hall 4 - Ground Floor
Mark Parsons · University of Edinburgh, The University of Edinburgh

Asterfusion Data Technologies Co., Ltd

Tuesday, June 23, 2026 1:06 PM to 1:08 PM
Hall 4 - Ground Floor
Harper Hong · Asterfusion Data Technologies Co., Ltd

Team

HL
Huan Liu
Overseas Exhibition ManagerAsterfusion Data Technologies Co., Ltd.
ZZ
Zoey Zhou
Overseas Business Development ManagerAsterfusion Data Technologies